卖什么
AI数据中心冷却。
商业模式拆解
买家：谁掌握预算？
未核实Data-center and AI infrastructure operators (facility/IT infrastructure leads) and server OEM partners.
触发点：什么让他们现在购买？
Rising chip heat loads (over 2,800W per chip) and water/power limits that air and water cooling cannot meet.
工作流：什么输入变成什么输出？
Six-step deployment: consult on data center requirements, align on a proposed cooling solution, confirm facility compatibility with third-party vendors, design around hurdles, install and test server retrofits, then train operators on operation and maintenance.
经济账：省了什么，怎么收费？
Hardware plus services and cloud software; claims smaller data centers, lower capex/opex; SoftBank rack measured pPUE 1.03.
渠道：怎么接触到客户？
Demo-led sales plus OEM/integrator partnerships (e.g. Foxconn) and a Partners page.
融资历史与报道
| 融资日期 | 轮次 | 金额 | 投资方 | 来源 |
|---|---|---|---|---|
| 2026-06-02 | C 轮 | $100M | — | news.google.com |
档案汇总自公开报道和公司官网。商业模式部分是 MaxBC 对这些材料的解读，不是已确认的事实；未知之处留空，不作猜测。 更新于 2026-10-12.