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Semiconductors, lasers, optics, lidar and sensors.
Part of Deep tech & other
By region: China 30 · North America 22 · Europe 18 · Other regions 15 · Korea 9 · Asia 6 · Japan 4
Li Auto chip subsidiary
Semiconductor equipment
An AI lab building self-improving systems, starting with chip design, aiming to shorten chip development timelines; team previously worked on AlphaChip, RL-CCD, Insta and C3PO.
Mecka AI collects first-person real-world data from body sensors and iPhones and turns it into training-ready data for humanoids and other robots.
Salience Labs makes silicon-photonics all-optical switches (OC-32M) for AI datacenters to cut data-movement bottlenecks and avoid power-hungry transceivers.
3D AI chips
AI chips, founded by ex-Qualcomm exec
3D compute-in-memory chips
Site (operated by 蓝芯算力(深圳)科技有限公司) presents compact, cost-effective chip solutions for full-scenario IoT terminals; page content is largely client-rendered.
Edge AI chips (NPUs) such as the DX-M1, with AI modules, systems and an SDK for running vision and on-device AI at low power.
Semiconductor engineering services from IC design to post-silicon test, embedded and system design, with test and validation labs.
Robots for semiconductor back-end manufacturing
Flash memory chips
Semiconductor engineering services
AI-native micro-machine maker.
Tactile sensors.
High-resolution (0.5m and sub-0.5m) optical remote-sensing cameras for satellites.
High-speed interconnect chips.
Laser communications for satellite constellations
Engineering AI.
Chips purpose-built for neural devices
VCSEL production for AI data centers.
AI greenhouse monitoring / crop sensing.
Technology to catch fake and flawed chips before they reach the market.
Precision photoelectric sensing technology.
Photonic gyroscopes for navigation without GPS.
Satellite laser ranging
Laser technology for AI chips.
AI chips.
Computer chips.
Sensor-based machine condition monitoring.
Tactile AI technology.
2D semiconductor technology.
Astrus uses reinforcement learning to automatically turn analog circuit requirements into manufacturing-ready physical chip layouts.
AI-for-science materials R&D (SynMatAI) for semiconductor materials such as CPO optical adhesives and thermal interface materials.
Passive acoustic-emission sensors plus AI classification software to monitor activity inside battery cells during formation, testing and operation.
AI chips.
AI chips.
Hybrid AI chip (GPNPU).
Thermal management for AI data centres, AI chips and robots.
Radar RF chips.
Space optical communication components (FSM); payload confirmed for Nuri rocket 5th launch.
On-device compute chips for robots.
Photonic integrated circuits.
Software to unify AI models and chips and match tasks to chips
Ultra-low-power AI semiconductors.
Turbine sensors.
Optical six-axis force sensors and sensing components for embodied-AI robots.
On-device inference chips.