Series A · 超过40亿元 · July 2026 · Chips, photonics & sensors · China
Advanced (3D) chip packaging pilot line and risk-production platform for AI compute, device, sensing-memory-compute and photonic chips.
| Round date | Stage | Amount | Investors | Source |
|---|---|---|---|---|
| 2026-07-07 | Series A | 超过40亿元 | — | cls.cn |
Profiles summarize public reporting and company websites. Business-model notes are MaxBC's reading of that material, not confirmed facts; unknowns are left blank rather than guessed. Updated 2026-10-11.
An AI lab building self-improving systems, starting with chip design, aiming to shorten chip development timelines; team previously worked on AlphaChip, RL-CCD, Insta and C3PO.
Mecka AI collects first-person real-world data from body sensors and iPhones and turns it into training-ready data for humanoids and other robots.
Salience Labs makes silicon-photonics all-optical switches (OC-32M) for AI datacenters to cut data-movement bottlenecks and avoid power-hungry transceivers.
Site (operated by 蓝芯算力(深圳)科技有限公司) presents compact, cost-effective chip solutions for full-scenario IoT terminals; page content is largely client-rendered.
Edge AI chips (NPUs) such as the DX-M1, with AI modules, systems and an SDK for running vision and on-device AI at low power.
Semiconductor engineering services from IC design to post-silicon test, embedded and system design, with test and validation labs.
