What it sells
Semiconductor packaging adhesive (underfill) materials
Business model breakdown
Buyer: who owns the budget?
UnverifiedProcess/R&D and materials engineers at semiconductor packaging houses (inferred from technical, formulation-focused product pages).
Trigger: what makes them buy now?
Packaging process problems: voids, warpage, fine-pitch fill, glass-substrate and HBM stacking requirements.
Workflow: what inputs become what output?
Customer reports a packaging process problem; COFA tunes epoxy/UV-cure formulations (flip chip underfill, board reinforcement, die attach, camera/optical module) and iterates quickly on R&D to fit the process.
Economics: what it saves and how it charges
Sells specialty adhesive materials by product line (10+ products, e.g. COFA 4100F/4200F/4300F underfills) with customer-specific formulation as the differentiator; team has 20+ years in adhesive formulation.
Distribution: how it reaches customers
Direct B2B: inquiry form (문의하기) and technical data/simulation pages; no online ordering.
Funding history and coverage
| Round date | Stage | Amount | Investors | Source |
|---|---|---|---|---|
| 2026-07-27 | Seed | — | — | news.google.com |
Profiles summarize public reporting and company websites. Business-model notes are MaxBC's reading of that material, not confirmed facts; unknowns are left blank rather than guessed. Updated 2026-10-12.