卖什么
半导体封装粘接（底部填充）材料
商业模式拆解
买家：谁掌握预算？
未核实Process/R&D and materials engineers at semiconductor packaging houses (inferred from technical, formulation-focused product pages).
触发点：什么让他们现在购买？
Packaging process problems: voids, warpage, fine-pitch fill, glass-substrate and HBM stacking requirements.
工作流：什么输入变成什么输出？
Customer reports a packaging process problem; COFA tunes epoxy/UV-cure formulations (flip chip underfill, board reinforcement, die attach, camera/optical module) and iterates quickly on R&D to fit the process.
经济账：省了什么，怎么收费？
Sells specialty adhesive materials by product line (10+ products, e.g. COFA 4100F/4200F/4300F underfills) with customer-specific formulation as the differentiator; team has 20+ years in adhesive formulation.
渠道：怎么接触到客户？
Direct B2B: inquiry form (문의하기) and technical data/simulation pages; no online ordering.
融资历史与报道
| 融资日期 | 轮次 | 金额 | 投资方 | 来源 |
|---|---|---|---|---|
| 2026-07-27 | 种子轮 | — | — | news.google.com |
档案汇总自公开报道和公司官网。商业模式部分是 MaxBC 对这些材料的解读，不是已确认的事实；未知之处留空，不作猜测。 更新于 2026-10-12.