What it sells
Copper-based hardware for AI.
Business model breakdown
Buyer: who owns the budget?
UnverifiedHardware/silicon engineering and procurement leads at OEMs, networking and data center system vendors.
Workflow: what inputs become what output?
System makers design Kandou connectivity silicon (USB4 and PCIe retimers, PCIe Gen5 switch, Glasswing chiplet interconnect IP) into devices and AI servers to move data between processors, memory and peripherals.
Economics: what it saves and how it charges
Sells semiconductor parts and licenses interconnect IP; claims over 10X lower cost, 3X lower power and 8X more scale for its AI systems.
Distribution: how it reaches customers
Direct to OEMs and chip/networking leaders via design wins (first design win with a global networking leader in 2017) and contact-us engagement.
Funding history and coverage
| Round date | Stage | Amount | Investors | Source |
|---|---|---|---|---|
| 2026-03-28 | — | $225M | — | news.google.com |
Profiles summarize public reporting and company websites. Business-model notes are MaxBC's reading of that material, not confirmed facts; unknowns are left blank rather than guessed. Updated 2026-10-12.