卖什么
用于AI的铜互连硬件。
商业模式拆解
买家：谁掌握预算？
未核实Hardware/silicon engineering and procurement leads at OEMs, networking and data center system vendors.
工作流：什么输入变成什么输出？
System makers design Kandou connectivity silicon (USB4 and PCIe retimers, PCIe Gen5 switch, Glasswing chiplet interconnect IP) into devices and AI servers to move data between processors, memory and peripherals.
经济账：省了什么，怎么收费？
Sells semiconductor parts and licenses interconnect IP; claims over 10X lower cost, 3X lower power and 8X more scale for its AI systems.
渠道：怎么接触到客户？
Direct to OEMs and chip/networking leaders via design wins (first design win with a global networking leader in 2017) and contact-us engagement.
融资历史与报道
| 融资日期 | 轮次 | 金额 | 投资方 | 来源 |
|---|---|---|---|---|
| 2026-03-28 | — | $225M | — | news.google.com |
档案汇总自公开报道和公司官网。商业模式部分是 MaxBC 对这些材料的解读，不是已确认的事实；未知之处留空，不作猜测。 更新于 2026-10-12.