What it sells
Photonics for AI superchips.
Business model breakdown
Buyer: who owns the budget?
UnverifiedChip/processor design and packaging teams at AI silicon vendors
Trigger: what makes them buy now?
AI models have grown 100x in 5 years while copper chiplet interconnects bottleneck bandwidth and efficiency, so chipmakers need optical interconnects to keep scaling processors.
Workflow: what inputs become what output?
Plugs into existing chiplet architectures and advanced packaging, replacing copper electrical interconnects between dies with optical links.
Economics: what it saves and how it charges
Claims <0.1 pJ/bit energy, >=60 Tbps/mm2 bandwidth density and >=50 mm reach; positioned as best performance per watt and per dollar. Revenue model not stated.
Distribution: how it reaches customers
Direct enterprise business development: a Chief Business Officer manages customer, supplier and partner accounts from first engagement through deal structuring and closing, with tier-one chipmakers and industry partners such as CEA-Leti.
Funding history and coverage
| Round date | Stage | Amount | Investors | Source |
|---|---|---|---|---|
| 2025-11-20 | Seed | 16 millions d'euros | MIG Capital | news.google.com |
Profiles summarize public reporting and company websites. Business-model notes are MaxBC's reading of that material, not confirmed facts; unknowns are left blank rather than guessed. Updated 2026-10-12.