卖什么
用于AI超级芯片的光子技术。
商业模式拆解
买家：谁掌握预算？
未核实Chip/processor design and packaging teams at AI silicon vendors
触发点：什么让他们现在购买？
AI models have grown 100x in 5 years while copper chiplet interconnects bottleneck bandwidth and efficiency, so chipmakers need optical interconnects to keep scaling processors.
工作流：什么输入变成什么输出？
Plugs into existing chiplet architectures and advanced packaging, replacing copper electrical interconnects between dies with optical links.
经济账：省了什么，怎么收费？
Claims <0.1 pJ/bit energy, >=60 Tbps/mm2 bandwidth density and >=50 mm reach; positioned as best performance per watt and per dollar. Revenue model not stated.
渠道：怎么接触到客户？
Direct enterprise business development: a Chief Business Officer manages customer, supplier and partner accounts from first engagement through deal structuring and closing, with tier-one chipmakers and industry partners such as CEA-Leti.
融资历史与报道
| 融资日期 | 轮次 | 金额 | 投资方 | 来源 |
|---|---|---|---|---|
| 2025-11-20 | 种子轮 | 16 millions d'euros | MIG Capital | news.google.com |
档案汇总自公开报道和公司官网。商业模式部分是 MaxBC 对这些材料的解读，不是已确认的事实；未知之处留空，不作猜测。 更新于 2026-10-12.