What it sells
Easing the AI chip bottleneck.
Business model breakdown
Buyer: who owns the budget?
UnverifiedPackaging/process technology leaders and BD at semiconductor firms.
Trigger: what makes them buy now?
AI memory wall: compute-memory interface is the bottleneck for AI scaling.
Workflow: what inputs become what output?
Deposits and patterns metal in a single step with a stamp electrode, producing sub-micron interconnects on large packages.
Economics: what it saves and how it charges
Technology/process licensing or manufacturing; claims 3x the throughput of existing fabs.
Distribution: how it reaches customers
Book a demo / contact; partner-led with investors and partners.
Funding history and coverage
| Round date | Stage | Amount | Investors | Source |
|---|---|---|---|---|
| 2026-04-21 | — | $26M | — | news.google.com |
Profiles summarize public reporting and company websites. Business-model notes are MaxBC's reading of that material, not confirmed facts; unknowns are left blank rather than guessed. Updated 2026-10-12.